Neenah, WI, United States of America

Paige E Chapman

This inventor holds 4 USPTO granted patents. Top assignee: Kimberly-Clark Worldwide, Inc.. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Paige E Chapman. Retrieved from https://idiyas.com/inventor/paige-e-chapman

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2022

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4 patents (USPTO):Explore Patents

Title: The Innovative Journey of Paige E. Chapman

Introduction

Paige E. Chapman is a notable inventor based in Neenah, WI (US). She has made significant contributions to the field of product packaging, holding a total of 4 patents. Her work is recognized for its creativity and practicality, making her a valuable asset in the industry.

Latest Patents

Among her latest patents, Paige has focused on advancements in product packaging. These innovations aim to enhance the functionality and sustainability of packaging solutions, reflecting her commitment to improving consumer products.

Career Highlights

Paige is currently employed at Kimberly-Clark Worldwide, Inc., where she applies her expertise in developing innovative packaging solutions. Her role at the company has allowed her to influence the design and functionality of various products, contributing to the company's reputation for quality and innovation.

Collaborations

Throughout her career, Paige has collaborated with talented individuals such as Jason Robert Boon and Benjamin Greengrass. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking solutions.

Conclusion

Paige E. Chapman exemplifies the spirit of innovation in product packaging. Her contributions and collaborations continue to shape the industry, making her a prominent figure in the world of inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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