Hsin-Chu, Taiwan

Pai-Wei Wang


Average Co-Inventor Count = 5.5

ph-index = 2

Forward Citations = 6(Granted Patents)


Location History:

  • Taoyuan, TW (2019)
  • Hsin-Chu, TW (2020)

Company Filing History:


Years Active: 2019-2020

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2 patents (USPTO):Explore Patents

Title: Pai-Wei Wang: Innovator in Semiconductor Technology

Introduction

Pai-Wei Wang is a prominent inventor based in Hsin-Chu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on advanced methods for fabricating integrated circuits, which are crucial for modern electronic devices.

Latest Patents

Wang's latest patents include a multiple patterning method for semiconductor devices. This innovative method involves fabricating an integrated circuit (IC) using a multiple patterning technique, which enhances the layout of the IC by deriving a graph that represents its features. The method allows for the selection and merging of vertices to optimize the connections between IC features. Another notable patent is the multiple patterning decomposition and manufacturing method for ICs. This method decomposes the layout features into nodes, classifies them, and assigns pseudo colors to facilitate the creation of masks for manufacturing.

Career Highlights

Pai-Wei Wang is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His expertise in multiple patterning techniques has positioned him as a key player in advancing semiconductor manufacturing processes.

Collaborations

Wang has collaborated with notable colleagues, including Ken-Hsien Hsieh and Chih-Ming Lai, who contribute to the innovative environment at their workplace.

Conclusion

Pai-Wei Wang's contributions to semiconductor technology through his patents and work at Taiwan Semiconductor Manufacturing Company Limited highlight his role as a significant innovator in the field. His advancements in multiple patterning methods are paving the way for future developments in integrated circuit fabrication.

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