Taipei, Taiwan

Pai-Chia Kuo

This inventor holds 1 USPTO granted patent. Top assignee: Academia Sinica. Active years: 2014.


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2014

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1 patent (USPTO):Explore Patents

Title: Innovations of Pai-Chia Kuo

Introduction

Pai-Chia Kuo is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of materials science and engineering. His work primarily focuses on the development of advanced phase plates for various applications.

Latest Patents

Kuo holds a patent titled "On-chip thin film Zernike phase plate and applications thereof." This invention provides an on-chip thin film phase plate designed for releasing charging. It comprises a chip substrate with one or more apertures and a thin film layer attached to the top surface of the chip substrate. The invention also includes a method for observing organic material by Transmission Electron Microscopy (TEM), utilizing the on-chip thin film phase plate within a TEM system. Kuo has 1 patent to his name.

Career Highlights

Kuo is affiliated with Academia Sinica, a prestigious research institution in Taiwan. His work at Academia Sinica has allowed him to engage in cutting-edge research and innovation. He has been instrumental in advancing the understanding of thin film technologies.

Collaborations

Kuo has collaborated with several esteemed colleagues, including Yong-fen Hsieh and Yuh-Lin Wang. These collaborations have fostered a productive research environment, leading to significant advancements in their respective fields.

Conclusion

Pai-Chia Kuo's innovative work in the development of on-chip thin film phase plates showcases his expertise and dedication to advancing technology. His contributions continue to impact the field of materials science and engineering.

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