This inventor holds 2 USPTO granted patents. Top assignee: Hk Systems, Inc.. Active years: 1997.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1997
Title: Owen N Reese, II: Innovator in Load Packaging Technology
Introduction
Owen N Reese, II is a notable inventor based in Montgomery, Alabama, recognized for his contributions to load packaging technology. With a total of two patents to his name, Reese has developed innovative solutions that enhance the efficiency of palletizing and wrapping processes.
Latest Patents
Reese's latest patent is titled "Apparatus and method for palletizing and wrapping a load." This invention features an apparatus designed for packaging and wrapping loads, incorporating an infeed conveyor that receives bundles from an assembly or production line. The system includes positioning conveyors that arrange the bundles into load layers, along with stripper plates that receive and discharge these layers. A pair of lifts located below the stripper plates work together to raise and lower a pallet, allowing for the efficient stacking of load layers. Additionally, a wrap ring with a film dispenser orbits below the stripper plates, dispensing plastic film around the load. The design also includes guide plates that stabilize the load prior to wrapping, ensuring a secure and efficient packaging process.
Career Highlights
Owen N Reese, II is currently employed at HK Systems, Inc., where he continues to innovate in the field of load packaging technology. His work has significantly contributed to advancements in automated packaging solutions, making processes more efficient and reliable.
Collaborations
Reese collaborates with Joseph F Franklin, a coworker who shares his commitment to innovation in the industry. Their teamwork fosters a creative environment that encourages the development of new ideas and technologies.
Conclusion
Owen N Reese, II stands out as a significant figure in the realm of load packaging technology, with his patents reflecting a deep understanding of automation and efficiency. His contributions continue to shape the industry and improve packaging processes.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile