Company Filing History:
Years Active: 1999-2006
Title: Owai H Low: Innovator in Microelectronic Packaging
Introduction
Owai H Low is a notable inventor based in Cupertino, CA (US). He has made significant contributions to the field of microelectronic packaging, holding a total of 3 patents. His innovative approaches have paved the way for advancements in the industry.
Latest Patents
Owai's latest patents include a method for insulating a bonding wire for microelectronic packaging. This method involves attaching a bonding wire to a bond pad and coating the bonding wire with an insulating liquid while drawing the bonding wire through a bond tool from the bond pad to a package lead. This innovative technique enhances the reliability and efficiency of microelectronic devices.
Career Highlights
Owai H Low is currently employed at LSI Logic Corporation, where he continues to develop cutting-edge technologies in microelectronics. His work has been instrumental in improving the performance and durability of electronic components.
Collaborations
Owai has collaborated with esteemed colleagues such as Chok J Chia and Ramaswamy Ranganathan. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Owai H Low's contributions to microelectronic packaging demonstrate his commitment to innovation and excellence in the field. His patents reflect a deep understanding of the complexities involved in electronic manufacturing, making him a valuable asset to the industry.