Lsi Logic Corporation

Owai H Low

Chok J Chia

Ramaswamy Ranganathan

Seng-Sooi Allen Lim

A method for insulating a bonding wire that includes the steps of attaching a bonding wire to a bond pad and coating the bonding wire with an insulating liquid while drawing the bonding wire through a bond tool from the bond pad to a package lead.

Insulated bonding wire tool for microelectronic packaging

Insulated bonding wire for microelectronic packaging

A semiconductor package (110) includes a tape substrate (135) having a top surface, a bottom surface, a plurality of conductive metal traces (115) formed on the top surface and a plurality of holes (130) arraigned in an array pattern formed through the tape substrate (135) exposing the conductive traces (115) from the bottom surface. A nonconductive metal plate or stiffener frame (155) attached to the bottom surface of the tape substrate (135) to support the tape substrate (135) during assembly. The stiffener frame (155) having through holes (160) corresponding to the holes (130) in the tape substrate (135) and being made from anodized aluminum, thus making it electrically nonconductive. An integrated circuit (IC) chip (120) is mounted on the top surface, opposite the stiffener frame (155). The IC chip (120) is in electrical connection to the traces (115) and a plurality of solder balls (125) are attached to the traces (115) through the holes (130 and 160), electrically connecting the semiconductor package (110) to a printed circuit board (170). Along with providing support for the tape substrate (135) during assembly, the stiffener frame (155) is used to improve the thermal performance of the semiconductor package (110) by dissipating the heat generated by the IC die (120) and improving the flatness of the finished semiconductor package (110).

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Cupertino, CA, United States of America

Owai H Low