This inventor holds 2 USPTO granted patents and 3 published patent applications. Top assignees: Stmicroelectronics (Grenoble 2) Sas, Stmicroelectronics (Alps) Sas. Active years: 2025-2026.
Company Filing History:
2 out of 646 
1 out of 160 
Years Active: 2025-2026
Title: The Innovative Contributions of Ouafa Hajji
Introduction
Ouafa Hajji is a notable inventor based in Voiron, France. He has made significant contributions to the field of electronics, particularly in the area of integrated circuit packaging. His innovative approach has led to the development of a unique patent that enhances the performance and reliability of electronic devices.
Latest Patents
Ouafa Hajji holds a patent for an "Integrated circuit package with heat sink and manufacturing method thereof." This invention features a support substrate that supports an electronic chip. An encapsulation coating on the support substrate coats the electronic chip, which includes a trench surrounding the chip. A heat sink is mounted to the encapsulation coating above the electronic chip, fixed by an adhesive material. Additionally, a thermal interface material layer is present between the electronic chip and the heat sink, with the trench positioned between these two materials. This innovative design improves heat dissipation and overall device performance.
Career Highlights
Ouafa Hajji is currently employed at STMicroelectronics (Grenoble 2) SAS, where he continues to work on cutting-edge technologies in the electronics sector. His expertise and innovative mindset have made him a valuable asset to the company.
Collaborations
He collaborates with talented coworkers, including Younes Boutaleb and Fabien Quercia, who contribute to the dynamic environment of innovation at STMicroelectronics.
Conclusion
Ouafa Hajji's contributions to integrated circuit packaging demonstrate his commitment to advancing technology in the electronics industry. His innovative patent reflects his expertise and dedication to improving electronic device performance.