The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2025

Filed:

Nov. 09, 2021
Applicant:

Stmicroelectronics (Grenoble 2) Sas, Grenoble, FR;

Inventors:

Younes Boutaleb, Grenoble, FR;

Fabien Quercia, Isere, FR;

Asma Hajji, Voiron, FR;

Ouafa Hajji, Voiron, FR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2005.12); H01L 23/00 (2005.12);
U.S. Cl.
CPC ...
H01L 23/3142 (2012.12); H01L 24/16 (2012.12); H01L 24/32 (2012.12); H01L 2224/16225 (2012.12); H01L 2224/32225 (2012.12); H01L 2224/73204 (2012.12);
Abstract

A support substrate supports an electronic chip. An encapsulation coating on the support substrate coats the electronic chip. The encapsulation coating includes a trench surrounding the electronic chip. A heat sink is mounted to the encapsulation coating above the electronic chip. The heat sink is fixed to the encapsulation coating by an adhesive material and a thermal interface material layer is present between the electronic chip and the heat sink. The trench is positioned between the thermal interface material layer and the adhesive material.


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