San Diego, CA, United States of America

Oswin M Schreiber

This inventor holds 5 USPTO granted patents. Top assignees: Applied Micro Circuits Corporation, Qualcomm Incorporated. Active years: 2004-2011.


% Patents Active = 80.0

Average Co-Inventor Count = 3.0

ph-index = 5

Forward Citations = 350(Granted Patents)


Company Filing History:


Years Active: 2004-2011

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5 patents (USPTO):Explore Patents

Title: The Innovations of Oswin M Schreiber

Introduction

Oswin M Schreiber is a notable inventor based in San Diego, CA. He has made significant contributions to the field of electronic assembly through his innovative designs. With a total of 5 patents, Schreiber has established himself as a key figure in the development of high-speed flexible interconnect cables.

Latest Patents

Schreiber's latest patents include a flexible interconnect cable with first and second signal traces disposed between first and second ground traces. This design provides different line width and line spacing configurations. The high-speed flexible interconnect cable for an electronic assembly consists of multiple conductive and dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high-speed electrical transmission line structures. The cable can be coupled to electronic components using various connection techniques and can be terminated with any number of known or standardized connector packages.

Career Highlights

Throughout his career, Schreiber has worked with prominent companies such as Applied Micro Circuits Corporation and Qualcomm Incorporated. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking technologies in the electronics industry.

Collaborations

Some of his notable coworkers include James Leroy Blair and Jeffrey Thomas Smith. Their collaboration has likely fostered an environment of innovation and creativity in their respective projects.

Conclusion

Oswin M Schreiber's contributions to the field of electronic assembly through his patents and collaborations highlight his importance as an inventor. His work continues to influence the development of high-speed interconnect technologies.

Profile summary based on public USPTO records.
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