Freeland, MI, United States of America

Oswald Bergman

This inventor holds 2 USPTO granted patents. Top assignee: The Dow Chemical Company. Active years: 1981-1983.


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 2

Forward Citations = 12(Granted Patents)


Company Filing History:


Years Active: 1981-1983

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2 patents (USPTO):Explore Patents

Title: Oswald Bergman: Innovator in Heat Sealing and Foam Shaping Technologies

Introduction

Oswald Bergman is a notable inventor based in Freeland, MI (US), recognized for his contributions to the fields of heat sealing and foam shaping technologies. With a total of 2 patents to his name, Bergman has made significant advancements that enhance manufacturing processes.

Latest Patents

Bergman's latest patents include a "Heat sealing apparatus and method," which features profiled heat seals in plastic film created by opposed profiled heat sealing platens supported on endless chains. These platens are heated through contact with associated heating drums. Another significant invention is the "Extruded plastic foam shaping apparatus," which provides adjustable forming plates for the extrusion of foam from a slot die. This apparatus includes a movable plate portion adjacent to the die face, featuring a semi-cylindrical groove. A pivoting forming plate with half-round edges is designed to enhance the extrusion process.

Career Highlights

Bergman is currently employed at The Dow Chemical Company, where he applies his expertise in developing innovative solutions for industrial applications. His work has contributed to the efficiency and effectiveness of various manufacturing processes.

Collaborations

Bergman collaborates with Robert A Hay, II, leveraging their combined knowledge and skills to drive innovation within their projects.

Conclusion

Oswald Bergman's inventive spirit and technical expertise have led to significant advancements in heat sealing and foam shaping technologies. His contributions continue to impact the manufacturing industry positively.

Profile summary based on public USPTO records.
Please report any incorrect information to [email protected]
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