This inventor holds 4 USPTO granted patents and 1 published patent application and 1 EPO patent. Top assignees: Tokuyama Corporation, Zeon Corporation. Active years: 2009-2012.
Location History:
- Syunan, JP (2009)
- Yamaguchi, JP (2011 - 2012)
Company Filing History:
4 out of 529 
2 out of 1,290 
Years Active: 2009-2012
Title: Osamu Yatabe: Innovator in Metallized Substrate Technology
Introduction
Osamu Yatabe is a notable inventor based in Syunan, Japan. He has made significant contributions to the field of metallized substrates, holding a total of 4 patents. His work focuses on enhancing the performance and reliability of semiconductor connections.
Latest Patents
Yatabe's latest patents include a metallized substrate and a method for producing the same. This invention features a ceramics substrate layered with various metals, including a high-melting point metal layer and a gold plating layer. The design ensures favorable connection strength for wire bonding, even after heating semiconductor chips in a mounted state. Another significant patent involves a method for fabricating a metallized ceramics substrate. This method includes forming multiple conductive paste layers with different particle sizes to secure airtightness in multilayered substrates.
Career Highlights
Throughout his career, Osamu Yatabe has worked with prominent companies such as Tokuyama Corporation and Zeon Corporation. His experience in these organizations has allowed him to refine his expertise in metallized substrate technology.
Collaborations
Yatabe has collaborated with notable coworkers, including Yoshihiro Chino and Takahiko Fukahori. Their combined efforts have contributed to advancements in the field of semiconductor technology.
Conclusion
Osamu Yatabe's innovative work in metallized substrates has significantly impacted the semiconductor industry. His patents reflect a commitment to improving connection strength and reliability in electronic devices.