Moriguchi, Japan

Osamu Shibata

This inventor holds 1 USPTO granted patent. Top assignee: Other. Active years: 2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Osamu Shibata. Retrieved from https://idiyas.com/inventor/osamu-shibata-g2oe01lo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 8.0

ph-index = 1

Forward Citations = 26(Granted Patents)


Company Filing History:

goldMedal1 out of 834,601 
Other
 patents

Years Active: 2003

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1 patent (USPTO):Explore Patents

Title: Osamu Shibata: Patent Inventor in Moriguchi, Japan

Introduction

Osamu Shibata is an inventor associated with Moriguchi, Japan. His patent work addresses tools for designing component layouts in multilayer wiring boards.

Latest Patents

The available information lists one patent for Shibata: “Circuit board design aiding apparatus, design aiding method, and storage medium storing design aiding program.” The invention supports efficient component placement in a board made by laminating multiple wiring layers. It acquires information about a location along the layers’ lamination direction and a location on the perpendicular two-dimensional plane, then generates information representing the space occupied when a component is placed at the specified reference point. The patent describes a system intended to aid wiring-board layout design. Shibata is credited with 1 patent in the supplied data.

Career Highlights

The supplied information identifies Shibata’s patent contribution but does not specify his employer or provide further details about his professional career.

Collaborations

Yukihiro Fukumoto and Shinichi Tanimoto are listed as Shibata’s coworkers. The available information does not specify their roles in the patent.

Conclusion

Osamu Shibata’s documented invention focuses on aiding component layout design for multilayer wiring boards, with the goal of making the design process more efficient.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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