Shizuoka, Japan

Osamu Oka


Average Co-Inventor Count = 1.7

ph-index = 6

Forward Citations = 105(Granted Patents)


Location History:

  • Shizuoka, JP (1992 - 2003)
  • Yaizu, JP (2004)

Company Filing History:

goldMedal31 out of 209 
 
Tomoegawa Paper Co., Inc.
 patents
silverMedal2 out of 832,718 
Other
 patents
where one patent can have more than one assignee

Years Active: 1992-2004

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31 patents (USPTO):Explore Patents

Title: Innovations of Osamu Oka in Semiconductor Adhesive Technologies

Introduction: Osamu Oka, a renowned inventor based in Shizuoka, Japan, has made significant contributions to the field of adhesive technologies for semiconductor devices. With a remarkable portfolio of 31 patents, Oka has demonstrated his expertise and commitment to advancing the performance and reliability of semiconductor applications.

Latest Patents: Oka's latest innovations include two notable patents focusing on adhesive compositions for semiconductor devices. The first patent describes an adhesive composition that includes 10 to 30% by weight of a reactive elastomer, 40 to 65% by weight of an epoxy resin with glycidyl ether groups, a phenol resin, and a curing accelerator. This innovative composition exhibits excellent reflow resistance and short-time, low-temperature bonding capabilities while maintaining critical properties such as heat resistance, low hygroscopicity, high adhesion, and electrical insulating characteristics.

The second patent centers on an adhesive composition that comprises an epoxy resin, a phenolic resin, an epoxidized styrene-butadiene-styrene block copolymer, and a diaminosiloxane compound. This formulation is characterized by its outstanding heat resistance, thermal cycling performance, and humidity resilience. In addition, an adhesive sheet utilizing this composition is also introduced, emphasizing Oka's ability to enhance the operational efficiency of semiconductor devices.

Career Highlights: Throughout his career, Osamu Oka has worked with esteemed organizations, including Tomoegawa Paper Co., Inc. His contributions in these environments have played a pivotal role in pushing the boundaries of semiconductor adhesive technology.

Collaborations: Oka's journey is also marked by collaboration with notable coworkers, including Takeshi Nishigaya and Jun Tochihira. These partnerships have undoubtedly enriched his innovative endeavors and resulted in advancements that benefit the industry.

Conclusion: Osamu Oka stands as a prominent figure in the realm of semiconductor adhesive technologies, with a commendable collection of patents that reflect his ingenuity and dedication. His latest inventions not only enhance the performance of semiconductor devices but also pave the way for further innovation in the field. As technology continues to evolve, Oka's contributions are likely to have a lasting impact on the industry.

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