Ibaraki, Japan

Osamu Degawa

USPTO Granted Patents = 6 

 

Average Co-Inventor Count = 2.1

ph-index = 3

Forward Citations = 12(Granted Patents)


Location History:

  • Osaka, JP (2009)
  • Ibaraki, JP (2013 - 2020)

Company Filing History:


Years Active: 2009-2020

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6 patents (USPTO):Explore Patents

Title: Osamu Degawa: Innovator in Adhesive Technologies

Introduction

Osamu Degawa is a prominent inventor based in Ibaraki, Japan. He has made significant contributions to the field of adhesive technologies, holding a total of 6 patents. His innovative approaches have led to advancements in adhesive sheet joining and pasting methods.

Latest Patents

Degawa's latest patents include an "Adhesive Sheet Joining Method and Adhesive Sheet Joining Apparatus." This invention features a die coater that directly applies an adhesive resin to a joining portion of a workpiece while it is in motion. A reinforcing substrate is then joined to the resin, creating an adhesive sheet directly on the workpiece. Another notable patent is the "Adhesive Sheet Pasting Method and Adhesive Sheet Pasting Apparatus." This invention utilizes a pasting roller with brush bristles arranged in rows to apply adhesive sheets to workpieces while adjusting the roller's speed to maintain consistent pressure.

Career Highlights

Osamu Degawa is currently employed at Nitto Denko Corporation, where he continues to develop innovative adhesive solutions. His work has been instrumental in enhancing the efficiency and effectiveness of adhesive applications in various industries.

Collaborations

Degawa has collaborated with notable coworkers, including Hiroichi Ukei and Yoshio Nakagawa, contributing to the advancement of adhesive technologies through teamwork and shared expertise.

Conclusion

Osamu Degawa's contributions to adhesive technologies through his patents and work at Nitto Denko Corporation highlight his role as a key innovator in the field. His inventions continue to influence the industry and improve adhesive application methods.

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