Growing community of inventors

Ibaraki, Japan

Osamu Degawa

Average Co-Inventor Count = 2.12

ph-index = 3

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 12

Osamu DegawaHiroichi Ukei (2 patents)Osamu DegawaYoshio Nakagawa (2 patents)Osamu DegawaShinsuke Ikishima (1 patent)Osamu DegawaTakeshi Igarashi (15 patents)Osamu DegawaToshitaka Suzuki (8 patents)Osamu DegawaMasakazu Kato (2 patents)Osamu DegawaYasuhiko Kawaguchi (1 patent)Osamu DegawaMasakazu Morimoto (1 patent)Osamu DegawaNao Wakayama (2 patents)Osamu DegawaTakuro Kanezaki (0 patent)Osamu DegawaOsamu Degawa (6 patents)Hiroichi UkeiHiroichi Ukei (16 patents)Yoshio NakagawaYoshio Nakagawa (14 patents)Shinsuke IkishimaShinsuke Ikishima (18 patents)Takeshi IgarashiTakeshi Igarashi (15 patents)Toshitaka SuzukiToshitaka Suzuki (8 patents)Masakazu KatoMasakazu Kato (4 patents)Yasuhiko KawaguchiYasuhiko Kawaguchi (5 patents)Masakazu MorimotoMasakazu Morimoto (5 patents)Nao WakayamaNao Wakayama (2 patents)Takuro KanezakiTakuro Kanezaki (0 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Nitto-denko Corporation (6 from 3,868 patents)


6 patents:

1. 10723917 - Adhesive sheet joining method and adhesive sheet joining apparatus

2. 10131090 - Adhesive sheet pasting method and adhesive sheet pasting apparatus

3. 9227812 - Adhesive sheet joining method and adhesive sheet joining apparatus

4. 8486505 - Pressure-sensitive adhesive sheet with release liner

5. 8394478 - Pressure-sensitive adhesive sheet with release liner

6. 7506678 - Adhesive tape joining apparatus

Please report any incorrect information to support@idiyas.com
idiyas.com
as of
12/5/2025
Loading…