Kikuchi, Japan

Osamu Araki

This inventor holds 1 USPTO granted patent. Top assignee: Ohashi & Associates. Active years: 1999.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Osamu Araki. Retrieved from https://idiyas.com/inventor/osamu-araki-34g7fbzt

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 32(Granted Patents)


Company Filing History:


Years Active: 1999

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1 patent (USPTO):Explore Patents

Title: Osamu Araki: Innovator in Multi-Spindle Machining Technology

Introduction

Osamu Araki is a notable inventor based in Kikuchi, Japan. He has made significant contributions to the field of machining technology, particularly with his innovative approach to multi-spindle machining apparatuses. His work focuses on enhancing machining precision and efficiency.

Latest Patents

Araki holds a patent for a "Multi-spindle machining apparatus and multi-spindle machining method." This invention addresses the challenges of machining discontinuous surfaces of multiple workpieces simultaneously. To mitigate issues such as chattering and oscillation, which can compromise machining precision, Araki's design incorporates variably sized drive pulleys. These pulleys randomly alter the rotational speeds transmitted to the machining spindles, ensuring that the cutting edges pass the discontinuities at irregular intervals.

Career Highlights

Throughout his career, Osamu Araki has been associated with Ohashi & Associates, where he has applied his expertise in machining technology. His innovative solutions have contributed to advancements in manufacturing processes, making them more efficient and precise.

Collaborations

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Conclusion

Osamu Araki's contributions to multi-spindle machining technology exemplify his commitment to innovation in the field. His patent reflects a deep understanding of machining dynamics and a dedication to improving manufacturing precision.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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