This inventor holds 1 USPTO granted patent. Top assignee: International Business Machines Corporation. Active years: 1992.
Company Filing History:
Years Active: 1992
Title: Orr Randy L: Innovator in Flexible Circuit Bonding
Introduction
Orr Randy L is a notable inventor based in Vestal, NY (US). He has made significant contributions to the field of flexible circuit technology. His innovative methods have paved the way for advancements in circuit bonding techniques.
Latest Patents
Orr holds a patent for a method of bonding a flexible circuit to a circuitized substrate. This method interconnects selected circuitry of both substrates using solder. The process involves applying solder paste over conductive pads on the circuitized substrate, along with an organic dewetting material. The flexible substrate is then positioned above the solder paste, and heat is applied to create a connection between the flexible circuit's conductor and the solder.
Career Highlights
Orr is associated with International Business Machines Corporation (IBM), where he has contributed to various projects and innovations. His work has been instrumental in enhancing the efficiency and reliability of electronic devices.
Collaborations
Orr has collaborated with notable coworkers, including Christopher G Angulas and Thomas E Kindl. Their combined expertise has led to advancements in the field of flexible circuits.
Conclusion
Orr Randy L's contributions to flexible circuit bonding represent a significant advancement in electronic technology. His innovative methods continue to influence the industry and inspire future developments.