Mountain View, CA, United States of America

Oliver R Garretson


Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 14(Granted Patents)


Company Filing History:


Years Active: 1976

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1 patent (USPTO):Explore Patents

Title: Oliver R Garretson: Innovator in Semiconductor Testing Technology

Introduction

Oliver R Garretson is a notable inventor based in Mountain View, CA (US). He has made significant contributions to the field of semiconductor testing through his innovative designs and methods. His work focuses on enhancing the effectiveness and utility of semiconductor devices and hybrid circuit substrates.

Latest Patents

Garretson holds a patent for a probe card that includes a multiplicity of probe contacts. This invention is particularly useful in testing semiconductor devices and hybrid circuit substrates before the application of terminal leads for interconnection with other components. The probe card features a unitary electrically conductive probe assembly with closely spaced conductive probes arranged in a radiating array. This design allows for a multiplicity of contact tips that can be pressed with uniform pressure and contact resistance on the terminal pads of semiconductor devices and hybrid circuit substrates.

Career Highlights

Garretson is associated with Xynetics, Inc., where he has been instrumental in developing advanced testing technologies. His work has contributed to improving the reliability and performance of semiconductor devices, which are critical in various electronic applications.

Collaborations

Garretson has collaborated with Richard C Harmon, working together to advance the field of semiconductor testing. Their partnership has led to innovative solutions that address the challenges faced in the industry.

Conclusion

Oliver R Garretson's contributions to semiconductor testing technology through his patent and work at Xynetics, Inc. highlight his role as an influential inventor in the field. His innovations continue to impact the effectiveness of semiconductor devices and hybrid circuit substrates.

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