Company Filing History:
Years Active: 2025-2026
Title: Okseon Yoon: Innovator in Semiconductor Packaging
Introduction
Okseon Yoon is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor technology. His innovative work focuses on enhancing the performance and reliability of semiconductor packages.
Latest Patents
Yoon holds a patent for a semiconductor package that includes underfill and a method of forming the same. This semiconductor package features a first semiconductor chip positioned on a lower structure. A first underfill is strategically placed between the first semiconductor chip and the lower structure. The first underfill consists of a first portion adjacent to the center region of the first semiconductor chip and a second portion adjacent to the edge region. Notably, the second portion has a higher degree of cure than the first portion. Additionally, a plurality of inner connection terminals is integrated between the first semiconductor chip and the lower structure, extending within the first underfill. This innovative design aims to improve the overall performance of semiconductor devices.
Career Highlights
Yoon is currently employed at Samsung Electronics Co., Ltd., a leading global technology company. His work at Samsung has allowed him to collaborate with some of the brightest minds in the industry. His contributions have been instrumental in advancing semiconductor packaging technologies.
Collaborations
Yoon has worked closely with his coworker, Jiyeong Kim, on various projects. Their collaboration has led to significant advancements in semiconductor technology.
Conclusion
Okseon Yoon's innovative work in semiconductor packaging exemplifies the importance of research and development in technology. His contributions continue to shape the future of semiconductor devices, making them more efficient and reliable.