Toyonaka, Japan

Nozomi Shinya

This inventor holds 1 USPTO granted patent. Top assignee: Minolta Company, Ltd.. Active years: 1998.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Nozomi Shinya. Retrieved from https://idiyas.com/inventor/nozomi-shinya

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 1998

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1 patent (USPTO):Explore Patents

Title: Nozomi Shinya: Innovator in Powder Filling Technology

Introduction

Nozomi Shinya is a notable inventor based in Toyonaka, Japan. He has made significant contributions to the field of powder filling technology. His innovative approach has led to the development of a unique method that enhances the efficiency of powder filling processes.

Latest Patents

Nozomi Shinya holds a patent for a powder filling method. This method involves supplying powder from a powder supply hopper into a container by pressurizing the air inside the hopper and/or the container. The air is then restored to atmospheric pressure by discharging the pressured air. This technique allows even powders with inferior filling performance to be filled into containers at a high density. He has 1 patent to his name.

Career Highlights

Shinya is currently employed at Minolta Company, Ltd., where he continues to innovate and develop new technologies. His work has been instrumental in improving the efficiency and effectiveness of powder filling methods in various applications.

Collaborations

One of his notable coworkers is Masami Eda, who contributes to the collaborative efforts within the company.

Conclusion

Nozomi Shinya's contributions to powder filling technology exemplify the impact of innovative thinking in industrial processes. His patent and ongoing work at Minolta Company, Ltd. highlight the importance of advancements in this field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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