Company Filing History:
Years Active: 1976-1985
Title: The Innovative Contributions of Norman Bahnck
Introduction
Norman Bahnck is a notable inventor based in Bethlehem, PA (US), recognized for his significant contributions to the field of semiconductor device handling and bonding technologies. With a total of 2 patents, Bahnck has developed innovative methods and apparatus that enhance the efficiency and precision of electronic device manufacturing.
Latest Patents
Bahnck's latest patents include groundbreaking technologies such as "Methods of and apparatus for handling semiconductor devices" and "Methods of and apparatus for bonding an article to a substrate." The first patent describes an apparatus designed for handling semiconductor devices that are temporarily mounted to an adhesively coated surface. This apparatus features an index table for positioning selected articles at a pickup axis, ensuring that the devices are removed from adhesive contact without tilting. The second patent outlines a bonder that facilitates the attachment of small electronic devices to substrates through a series of meticulously controlled stations, ensuring precise alignment and bonding.
Career Highlights
Throughout his career, Bahnck has worked with prominent companies such as AT&T Technologies, Inc. and Western Electric Company, Inc. His experience in these organizations has contributed to his expertise in the field of semiconductor technology and electronic device manufacturing.
Collaborations
Bahnck has collaborated with notable individuals in the industry, including Philip Kloap and Raymond H. Booth. These collaborations have likely enriched his work and contributed to the development of his innovative patents.
Conclusion
Norman Bahnck's contributions to semiconductor device handling and bonding technologies have made a significant impact on the electronics industry. His innovative patents reflect his dedication to advancing manufacturing processes and improving the efficiency of electronic device production.