Aichi, Japan

Noriyuki Wada

This inventor holds 1 USPTO granted patent. Top assignee: Taiho Kogyo Co., Ltd.. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Noriyuki Wada. Retrieved from https://idiyas.com/inventor/noriyuki-wada-iglhd944

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Noriyuki Wada: Innovator in Sliding Member Technology

Introduction

Noriyuki Wada is a prominent inventor based in Aichi, Japan. He is known for his innovative contributions to the field of sliding member technology. With a focus on enhancing the performance and durability of sliding components, Wada has made significant strides in engineering.

Latest Patents

Wada holds a patent for a sliding member that includes a base material, a porous sintered layer, and a resin layer. The design features a unique structure where the porosity of the porous sintered layer decreases from one surface to another. This innovative approach improves the functionality and longevity of the sliding member.

Career Highlights

Wada is associated with Taiho Kogyo Co., Ltd., a company recognized for its advancements in automotive and industrial components. His work has contributed to the development of high-performance materials that are essential in various applications.

Collaborations

Wada has collaborated with notable colleagues, including Naoki Horibe and Hiroshi Ito. Their combined expertise has fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Noriyuki Wada's contributions to sliding member technology exemplify the impact of innovative thinking in engineering. His work continues to influence the industry and inspire future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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