Tokyo, Japan

Noriyoshi Obara


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Noriyoshi Obara: Innovator in Seamless Can Technology

Introduction

Noriyoshi Obara is a prominent inventor based in Tokyo, Japan. He is known for his innovative contributions to the field of packaging technology, particularly in the development of seamless cans. His work has significantly impacted the manufacturing processes within the industry.

Latest Patents

Obara holds a patent for a "Polyester-resin-coated seamless can and method for manufacturing the same." This invention features a polyester-resin-coated seamless can that includes a reduced diameter portion obtained by neck processing. This processing occurs within a distance of 0% to 15% from the can body uppermost portion, relative to the total height of the can. The patent specifies that a ratio Im/Iu is 1.0 or more, where Iu is calculated by dividing a maximum peak intensity in a specific range of an outer-surface coating by the thickness of the coating at the measurement site. Im is similarly calculated for a different measurement site within the can.

Career Highlights

Obara is associated with Toyo Seikan Co., Ltd., a leading company in the packaging industry. His work at this company has allowed him to focus on advancements in can manufacturing and coating technologies. His innovative approach has led to the development of more efficient and effective packaging solutions.

Collaborations

Obara has collaborated with notable coworkers, including Shota Uchino and Seitaro Kanazawa. These collaborations have fostered a creative environment that encourages the exchange of ideas and technological advancements.

Conclusion

Noriyoshi Obara's contributions to seamless can technology exemplify the importance of innovation in the packaging industry. His patent and work at Toyo Seikan Co., Ltd. highlight his commitment to advancing manufacturing processes. His achievements serve as an inspiration for future inventors in the field.

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