This inventor holds 2 USPTO granted patents. Top assignee: Kaijo Corporation. Active years: 2007-2011.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2007-2011
Title: Noritaka Horiuchi: Innovator in Semiconductor Bonding Technology
Introduction
Noritaka Horiuchi is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor technology, particularly in wire bonding methods. With a total of 2 patents to his name, Horiuchi's work focuses on improving the efficiency and accuracy of semiconductor manufacturing processes.
Latest Patents
Horiuchi's latest patents include an innovative inspection method for determining the bonded status of a wire ball in wire bonding. This method involves capturing an image of the bonding position between the pad and the ball of a semiconductor chip. The inspection utilizes a color-switching coaxial illuminating light to enhance the detection of various parameters, such as the in-focus height of the pad and the bonded ball. Specifically, blue light is employed for detecting the pad and the external diameter of the bonded ball, while red or yellow light is used for assessing the upper surface of the bonded ball and the bonding point.
Another notable patent by Horiuchi is a method for measuring the thickness of a bonded ball in wire bonding. This method includes taking images of the pad and the ball at different vertical positions to analyze luminance variations. By determining the in-focus heights of both the pad and the upper surface of the ball, the thickness of the ball can be accurately calculated.
Career Highlights
Horiuchi is currently associated with Kaijo Corporation, where he continues to develop and refine his innovative techniques in semiconductor technology. His expertise in wire bonding has positioned him as a key figure in the industry, contributing to advancements that enhance manufacturing processes.
Collaborations
Horiuchi collaborates with Kimiji Nishimaki, a fellow innovator in the field. Together, they work on projects that aim to push the boundaries of semiconductor technology and improve production efficiency.
Conclusion
Noritaka Horiuchi's contributions to semiconductor bonding technology are noteworthy and impactful. His innovative patents reflect a commitment to advancing the field and improving manufacturing processes. Horiuchi's work continues to influence the industry, showcasing the importance of innovation in technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile