Company Filing History:
Years Active: 2016-2024
Title: Norihiro Kokudo: Innovator in Adhesion-Preventing Materials
Introduction
Norihiro Kokudo is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of biocompatible materials, particularly in the development of adhesion-preventing compositions. With a total of three patents to his name, Kokudo's work addresses critical challenges in medical applications.
Latest Patents
Kokudo's latest patents focus on an adhesion-preventing material that exhibits a high adhesion-preventing effect. This innovative material includes a sterilized biocompatible sponge-like laminate. The laminate consists of a sponge-like first layer and a sponge-like second layer, both of which are at least partially crosslinked with a curing agent. The first layer contains a low-endotoxin alginic acid monovalent metal salt with a weight average molecular weight ranging from 10,000 to 2,000,000. In contrast, the second layer has a weight average molecular weight between 1,000 and 1,000,000. The weight average molecular weights are measured using a GPC-MALS method after a decrosslinking treatment, ensuring that the first layer's molecular weight is higher than that of the second layer.
Career Highlights
Kokudo has had a distinguished career, working with esteemed institutions such as The University of Tokyo and Mochida Pharmaceutical Co., Ltd. His research and innovations have significantly impacted the field of medical materials, particularly in enhancing patient outcomes through improved adhesion prevention.
Collaborations
Kokudo has collaborated with notable colleagues, including Taichi Ito and Seiichi Ohta. Their combined expertise has contributed to the advancement of biocompatible materials and their applications in medicine.
Conclusion
Norihiro Kokudo's work in adhesion-preventing materials showcases his dedication to innovation in the medical field. His patents reflect a commitment to improving biocompatibility and patient care through advanced material science.