Chiba, Japan

Norihiro Harada

This inventor holds 1 USPTO granted patent. Top assignee: Subaru Corporation; Kinugawa Rubber Ind. Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Norihiro Harada. Retrieved from https://idiyas.com/inventor/norihiro-harada-b2v35fmn

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Norihiro Harada and His Rubber-Molding Patent

Introduction

Norihiro Harada is an inventor associated with Chiba, Japan. His listed patent concerns a rubber molded body made from a composition combining natural rubber, butadiene rubber, and low-melting additives.

Latest Patents

Harada is credited with 1 patent, titled “Rubber Molded Body.” The patent describes a rubber composition in which natural rubber and butadiene rubber are the predominant components, with their mass ratio ranging from 80/20 to 10/90. It also specifies low-melting paraffin wax with a melting point of 45°C to 57°C, used at 20 to 70 parts by mass per 100 parts of all rubber components. A low-melting fatty acid amide may also be included. The combined amount of the wax and amide is specified as 30 to 100 parts by mass per 100 parts of all rubber components.

Career Highlights

Harada’s listed company affiliations include Subaru Corporation and Kinugawa Rubber Ind. Co., Ltd. The available information connects his work with rubber materials and molded products.

Collaborations

Kazuhito Furuya and Yasushi Morita are identified as Harada’s coworkers. The provided information does not specify their roles in the patent or the extent of their collaboration.

Conclusion

Norihiro Harada’s listed patent focuses on a rubber molded body and defines a composition using natural rubber, butadiene rubber, and low-melting additives.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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