Norihiko Ikai

Title: Norihiko Ikai: Innovator in Printed Wiring Board Technology

Introduction

Norihiko Ikai is a notable inventor based in Komaki, Japan. He has made significant contributions to the field of printed wiring board technology. His innovative work has led to the development of a unique paste that enhances the manufacturing process of printed wiring boards.

Latest Patents

Ikai holds a patent for a "Paste for through-hole filling and printed wiring board using the same." This paste is designed for filling through-holes in printed wiring boards and consists of an epoxy resin composition combined with a metallic filler. The formulation includes 100 parts by weight of an epoxy resin composition, which contains 90 to 99.5 parts by weight of an epoxy resin and 0.5 to 10 parts by weight of a curing agent. Additionally, it incorporates 500 to 1000 parts by weight of a metallic filler with an average particle size of 0.5 to 20 micrometers. The paste exhibits a viscosity of not higher than 20,000 poise at 25°C and a volatile content of not more than 1.0% when heated during the filling step. Notably, it demonstrates excellent shrink-resistance properties, ensuring minimal shrinkage during the solder reflow process.

Career Highlights

Norihiko Ikai is currently employed at NGK Spark Plug Company, Limited, where he continues to innovate in the field of electronic components. His work has been instrumental in improving the reliability and efficiency of printed wiring boards.

Collaborations

Ikai has collaborated with esteemed colleagues such as Hiroshi Sumi and Masahiko Okuyama. Their combined expertise has contributed to advancements in the technology surrounding printed wiring boards.

Conclusion

Norihiko Ikai's contributions to the field of printed wiring board technology through his innovative paste formulation highlight his role as a significant inventor. His work continues to influence the industry and improve manufacturing processes.