Nobuyuki Suefuji

Title: **Nobuyuki Suefuji: Innovator in Semiconductor Bonding Technology**

Introduction

Nobuyuki Suefuji is a distinguished inventor based in Fukuoka, Japan, recognized for his significant contributions to the field of semiconductor technology. With a portfolio comprising five patents, Suefuji focuses on enhancing the methods and devices used in die bonding processes, which are crucial for the assembly of semiconductor chips.

Latest Patents

One of his latest innovations is the "Paste applicator and paste application method for die bonding." This invention introduces a sophisticated paste applicator that adheres semiconductor chips onto substrates more efficiently. The application method leverages data on paste application volume and pattern, which are deduced from the paste thickness and chip size. The system utilizes a dispensing flow rate calculator to optimize the flow rate of a paste dispenser, which is controlled to apply paste precisely via an application nozzle. This advancement offers improved accuracy and reliability in the bonding process.

Another significant patent is the "Bonding paste applicator and method of using it." The aim of this invention is to deliver superior paste application quality and enhanced operability. This method allows for seamless application of bonding paste through a nozzle that is guided by pre-stored drawing patterns for X, Y, and Z movements. This innovation greatly minimizes the need for manual setup, providing consistent results and eliminating variability during the paste application process.

Career Highlights

Nobuyuki Suefuji is known for his role at Matsushita Electric Industrial Co., Ltd. where he has made substantial contributions to semiconductor packaging technology. His work in this field has not only advanced product quality but has also streamlined manufacturing processes, confirming his status as a key figure in technological innovation.

Collaborations

Throughout his career, Suefuji has collaborated with esteemed colleagues such as Seiichi Sato and Mitsuru Ozono. These collaborations have fostered a dynamic exchange of ideas, further driving advancements in semiconductor technology and enhancing the effectiveness of their joint initiatives.

Conclusion

Nobuyuki Suefuji stands out as an influential inventor in the semiconductor arena, leveraging innovative methodologies to solve complex bonding challenges. His patents reflect a commitment to improving the efficiency and quality of semiconductor assembly processes, marking him as a notable contributor to the technology landscape in Japan and beyond.