Company Filing History:

18 out of 52,735

Kabushiki Kaisha Toshiba

patents

2 out of 2,916

Tokyo Shibaura Denki Kabushiki Kaisha

patents

Years Active: 1983-1999

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20 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 5909058 - Semiconductor package and semiconductor mounting part (1999-06-01),

2. 5907187 - Electronic component and electronic component connecting structure (1999-05-25),

3. 5622769 - Ceramic circuit board having a thermal conductivity substrate (1997-04-22),

4. 5453991 - Integrated circuit device with internal inspection circuitry (1995-09-26),

5. 5412160 - Circuit board (1995-05-02),

6. 5326623 - Circuit board (1994-07-05),

7. 5041700 - Circuit board including an aluminum nitride substrate and a multilayered (1991-08-20),

8. 5008582 - Electronic device having a cooling element (1991-04-16),

9. 4970571 - Bump and method of manufacturing the same (1990-11-13),

10. 4963701 - Circuit board (1990-10-16),

11. 4919731 - Brazing paste (1990-04-24),

12. 4916261 - Circuit substrate and producing method of the same (1990-04-10),

13. 4906341 - Method of manufacturing semiconductor device and apparatus therefor (1990-03-06),

14. 4855251 - Method of manufacturing electronic parts including transfer of bumps of (1989-08-08),

15. 4835344 - Electronic component parts and method for manufacturing the same (1989-05-30),

Title: Nobuo Iwase: Innovator in Semiconductor Technology

Introduction

Nobuo Iwase is a prolific inventor based in Kamakura, Japan, with an impressive portfolio of 20 patents. His contributions to semiconductor technology reflect significant advancements in the field, showcasing his expertise and innovative spirit.

Latest Patents

Iwase's latest patents include a groundbreaking semiconductor package and a semiconductor mounting part. The semiconductor package features a thin design that minimizes thermal and electric resistance, utilizing a nitride ceramic supporting substrate. Notably, the substrate has via-holes that enhance its functionality. This package integrates a resin film with a wiring layer, allowing for efficient electrical connections with external terminals.

Additionally, his patent related to electronic components and their connecting structures introduces a novel approach to connecting bumps used in semiconductor packages. By employing different types of connecting bumps with varying melting points and mechanical strengths, Iwase has increased the reliability of these semiconductor components while maintaining a high count of input and output terminals.

Career Highlights

Throughout his distinguished career, Nobuo Iwase has worked with prominent companies such as Kabushiki Kaisha Toshiba and Tokyo Shibaura Denki Kabushiki Kaisha. His time in these organizations has allowed him to refine his expertise and contribute to cutting-edge technologies in the semiconductor industry.

Collaborations

Iwase has collaborated with esteemed colleagues, including Kiyoshi Iyogi and Takaaki Yasumoto. Together, they have pushed the boundaries of innovation, teaming up to develop advanced technologies that have set new standards in semiconductor design and functionality.

Conclusion

In summary, Nobuo Iwase is a notable figure in the world of innovations, particularly within the semiconductor sector. His extensive patent portfolio and collaborative efforts underscore his commitment to advancing technology and improving electronic component reliability. His work continues to influence the industry, paving the way for future developments in semiconductor technology.

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