This inventor holds 1 USPTO granted patent. Top assignee: Nippondenso Co., Ltd.. Active years: 1989.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1989
Title: Nobumasa Isida: Innovator in Electroless Copper Plating Solutions
Introduction
Nobumasa Isida is a notable inventor based in Chiryu, Japan. He has made significant contributions to the field of electroless copper plating, which is essential in various industrial applications. His innovative approach has led to the development of a unique plating solution that enhances deposition rates.
Latest Patents
Nobumasa Isida holds 1 patent for his invention titled "Electroless copper plating solution and process for electrolessly." This patent describes a method for achieving a practically fast electroless copper deposition by utilizing a trialkanolmonoamine as a complexing agent for copper ions. The process allows for an optimum deposition rate of 100 µm/hr, even in the presence of various additives.
Career Highlights
Isida is associated with Nippondenso Co., Ltd., where he has applied his expertise in developing advanced plating solutions. His work has been instrumental in improving the efficiency and effectiveness of electroless copper deposition processes.
Collaborations
Throughout his career, Nobumasa Isida has collaborated with talented individuals such as Katuhiko Murakawa and Futoshi Ishikawa. These collaborations have contributed to the advancement of technology in the field of electroless plating.
Conclusion
Nobumasa Isida's innovative work in electroless copper plating solutions showcases his dedication to advancing industrial processes. His contributions have made a lasting impact on the field, and his patent reflects his commitment to innovation.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile