Company Filing History:
Years Active: 2009
Title: Nobuhiro Nanri: Innovator in Electronic Cooling Solutions
Introduction
Nobuhiro Nanri is a prominent inventor based in Kobe, Japan. He is known for his innovative contributions to electronic cooling technologies. His work focuses on enhancing the efficiency of electronic components through effective heat management solutions.
Latest Patents
Nobuhiro Nanri holds a patent for a "Heat-absorbing member, cooling device, and electronic apparatus." This invention addresses the challenge of heat dissipation in electronic devices. The patent describes a system where electronic components of varying heights, such as a CPU, capacitor, and coil elements, are mounted on a printed circuit board. A heat-absorbing member is strategically placed above the circuit board to ensure contact with the CPU's top surface and the sides of the capacitor and coil elements. This design facilitates the circulation of a cooling medium through a flow path formed in the heat-absorbing member. Heat generated at the CPU is efficiently transmitted to the cooling medium, enhancing the overall performance of electronic devices.
Career Highlights
Nobuhiro Nanri is associated with Fujitsu Corporation, a leading technology company known for its advancements in computing and electronics. His work at Fujitsu has allowed him to contribute significantly to the field of electronic cooling solutions. With a focus on innovation, he has developed technologies that improve the reliability and efficiency of electronic devices.
Collaborations
Nobuhiro has collaborated with notable colleagues, including Jun Taniguchi and Hiroki Uchida. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies in the electronics sector.
Conclusion
Nobuhiro Nanri's contributions to electronic cooling technologies exemplify the importance of innovation in the electronics industry. His patented solutions not only enhance device performance but also pave the way for future advancements in heat management.