Akishima, Japan

Nobuaki Hirai


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2002

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Nobuaki Hirai: Innovator in Wire Bonding Technology

Introduction

Nobuaki Hirai is a distinguished inventor based in Akishima, Japan. He is known for his contributions to the field of wire bonding technology, which is essential in the manufacturing of electronic components. His innovative approach has led to the development of a unique patent that enhances the efficiency and accuracy of wire bonding processes.

Latest Patents

Hirai holds a patent for a "Wire bonding method and apparatus." This invention involves a sophisticated process where, after the tail of a wire extends out of a capillary, the capillary moves to a measurement position above a tail length measuring member. The capillary then descends to ensure that the end of the tail contacts the measuring member. The system detects the position of the capillary or the distance it is lowered when electrical continuity is established. The tail length is calculated based on various parameters, including the height level of the measuring member and the positions of the capillary during the measurement process. This innovation significantly improves the precision of wire bonding in electronic devices.

Career Highlights

Nobuaki Hirai is currently employed at Kabushiki Kaisha Shinkawa, a company recognized for its advancements in precision manufacturing technologies. His work at Shinkawa has allowed him to apply his inventive skills in a practical setting, contributing to the company's reputation for quality and innovation in the electronics industry.

Collaborations

Hirai collaborates with talented professionals in his field, including Tooru Mochida and Tatsunari Mii. These collaborations foster a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Nobuaki Hirai's contributions to wire bonding technology exemplify the spirit of innovation in the electronics industry. His patent not only showcases his inventive capabilities but also highlights the importance of precision in manufacturing processes. His work continues to influence the field, paving the way for future advancements.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…