Noboru Yoshida

Title: Noboru Yoshida: Innovator in Semiconductor Technology

Introduction

Noboru Yoshida is a prominent inventor based in Okayama, Japan. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative spirit and technical expertise.

Latest Patents

One of his latest patents is a lead frame designed for use with an RF powered semiconductor. This semiconductor device features a square die pad, to which a semiconductor chip is adhered using a silver paste member. The design includes first leads that are integrally formed with the die pad and a pair of second leads extending outward. The inner ends of the second leads have a width-increased end portion that is parallel to the longer side of the die pad. Additionally, a through hole connects the width-increased end portion to the outer portion of each second lead. The semiconductor chip is electrically connected to the second leads via wires and to the die pad through a grounding wire.

Career Highlights

Noboru Yoshida is currently employed at Matsushita Electronics Corporation, where he continues to push the boundaries of semiconductor technology. His work has been instrumental in advancing the capabilities of electronic devices.

Collaborations

Throughout his career, Noboru has collaborated with notable colleagues, including Masao Nakayama and Isamu Yuasa. These partnerships have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Noboru Yoshida's contributions to semiconductor technology reflect his dedication to innovation and excellence. His patents and work at Matsushita Electronics Corporation highlight his role as a key figure in the advancement of electronic devices.