Company Filing History:
1 out of 30 
1 out of 1 
2 out of 832,912 Years Active: 1999-2002
Title: Noboru Shingai: Innovator in Circuit Board Technology
Introduction
Noboru Shingai is a prominent inventor based in Yokohama, Japan. He has made significant contributions to the field of circuit board technology, holding a total of 3 patents. His innovative designs have paved the way for advancements in semiconductor packaging.
Latest Patents
One of Noboru Shingai's latest patents is focused on a circuit board and its manufacturing method. This circuit board features bump patterns with minimal height variation on its surface, allowing for high-density packaging of semiconductor components. The design incorporates conductor circuits that are embedded in an insulating base, which consists of a resist layer and an insulating substrate. The bumps on the surface of the insulating base are electrically connected to the conductor circuits through pillar-shaped conductors formed by electroplating. Each bump is a multilayer structure created by successively depositing different electrically conductive materials.
Career Highlights
Throughout his career, Noboru Shingai has worked with notable companies, including Meiko Electronics Co., Ltd. His expertise in circuit board technology has been instrumental in developing innovative solutions for the electronics industry.
Collaborations
Noboru has collaborated with talented individuals such as Tatsuo Wada and Katsuro Aoshima. These partnerships have contributed to the advancement of his projects and the successful implementation of his inventions.
Conclusion
Noboru Shingai's work in circuit board technology exemplifies his commitment to innovation and excellence. His patents reflect a deep understanding of the complexities involved in semiconductor packaging, making him a key figure in the field.