Osaka, Japan

Noahiro Ikeda

This inventor holds 1 USPTO granted patent. Top assignee: Fujicopian Co., Ltd.. Active years: 1994.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Noahiro Ikeda. Retrieved from https://idiyas.com/inventor/noahiro-ikeda

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 1994

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Inventor Spotlight: Noahiro Ikeda

Introduction

Noahiro Ikeda is an innovative inventor based in Osaka, Japan, known for his contributions to thermal transfer technology. With a unique approach to enhancing printing processes, he has secured a patent that highlights his expertise and creativity in the field.

Latest Patents

Ikeda's notable patent is the Multi-usable thermal transfer ink sheet. This invention comprises a foundation along with a heat-meltable, multi-transferable ink layer and a heat-meltable overcoat. The overcoat is designed with a greater cohesive force than the ink layer itself, enabling improved adaptability to rough paper surfaces and resistance to paper staining, while also ensuring a desired multi-printing property.

Career Highlights

Throughout his career, Noahiro Ikeda has demonstrated his commitment to innovation while working at Fujicopian Co., Ltd. His patent illustrates his capability to enhance existing technologies, making significant advancements in the printing industry.

Collaborations

In his professional journey, Ikeda has collaborated with prominent coworkers, including Takao Arimura and Masao Saisho. Their collective efforts have contributed to the development and success of innovative projects within the company and the industry.

Conclusion

Noahiro Ikeda is a distinguished inventor whose patent demonstrates his ability to create practical solutions that meet the demands of modern printing technology. His work continues to impact the field, offering new avenues for efficiency and effectiveness in thermal transfer applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…