Suwon-si, South Korea

No Jun Kwak

This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electro-Mechanics Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: No Jun Kwak. Retrieved from https://idiyas.com/inventor/no-jun-kwak-esh8wcob

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: No Jun Kwak: Inventor in Multilayer Electronic Components.

Introduction

No Jun Kwak is an inventor associated with Samsung Electro-Mechanics in Suwon-si, South Korea. His patent work includes a multilayer electronic component designed with nickel-and-indium-containing internal electrodes.

Latest Patents

Kwak is credited with 1 patent: “Multilayer Electronic Component Including Internal Electrode Having Nickel and Indium.” The invention describes a component with dielectric layers and internal electrodes arranged alternately within a body, along with an external electrode. At least one internal electrode contains nickel and indium, with specified indium-to-nickel-plus-indium molar-ratio thresholds at points near the dielectric interface and at central points. These compositional limits define the distribution of indium within the electrode.

Career Highlights

Kwak’s listed patent reflects work on the materials and structure of multilayer electronic components. The invention focuses on controlling the composition of internal electrodes in relation to adjacent dielectric layers.

Collaborations

Kwak’s listed coworkers include Jun Oh Kim and Sung Hwan Lee. The patent information provided identifies Samsung Electro-Mechanics as his company.

Conclusion

No Jun Kwak’s patent documents a materials-focused approach to multilayer electronic component design, particularly the controlled use of nickel and indium in internal electrodes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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