Fujian, China

Ningbo Du

This inventor holds 1 USPTO granted patent. Top assignee: Contemporary Amperex Technology (Hong Kong) Limited. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ningbo Du. Retrieved from https://idiyas.com/inventor/ningbo-du

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Ningbo Du - Innovator in Film Laminating Technology

Introduction

Ningbo Du is a prominent inventor based in Fujian, China. He has made significant contributions to the field of film laminating technology. His innovative approach has led to the development of a unique apparatus that enhances the efficiency of electrode sheet processing.

Latest Patents

Ningbo Du holds 1 patent for his invention titled "Film Laminating Apparatus and Electrode Sheet Processing Device." This invention features a film laminating apparatus that includes a frame, a conveying mechanism, a mounting plate, and multiple film laminating mechanisms. The design allows for the efficient conveyance of an electrode sheet, optimizing the space and volume occupied by the apparatus.

Career Highlights

Ningbo Du is currently employed at Contemporary Amperex Technology (Hong Kong) Limited. His work focuses on advancing technologies that improve the manufacturing processes of electronic components. His dedication to innovation has positioned him as a key player in his field.

Collaborations

Ningbo Du collaborates with various professionals, including his coworker Hong Lin. Together, they work on projects that aim to push the boundaries of technology in their industry.

Conclusion

Ningbo Du's contributions to film laminating technology exemplify his commitment to innovation and efficiency. His patent and ongoing work continue to influence the field positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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