Singapore, Singapore

Ning Zeng

This inventor holds 1 USPTO granted patent. Top assignee: Molex Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ning Zeng. Retrieved from https://idiyas.com/inventor/ning-zeng-uqwjcbwc

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Ning Zeng: Innovator in Connector Technology

Introduction

Ning Zeng is a notable inventor based in Singapore, recognized for his contributions to connector technology. With a focus on innovative designs, he has developed solutions that enhance the functionality and efficiency of connector assemblies.

Latest Patents

Ning Zeng holds a patent for a "Connector assembly with mating process." This invention includes a first connector and a second connector, where the first connector features a first housing and a first terminal. The first terminal has a contact portion that extends in a specific direction. The second connector also includes a housing and a terminal that extends in the same direction, facilitating a unique mating process. This process involves the connectors moving toward each other along one direction and then along a perpendicular direction, ensuring a secure connection between the terminals.

Career Highlights

Ning Zeng is currently employed at Molex Corporation, a leading company in the field of electronic connectors. His work at Molex has allowed him to apply his innovative ideas and contribute to the development of advanced connector solutions.

Collaborations

Ning collaborates with Kai Murakami, a talented coworker who brings her expertise to their projects. Together, they work on enhancing connector technologies and exploring new possibilities in the field.

Conclusion

Ning Zeng's innovative work in connector technology exemplifies the impact of dedicated inventors in advancing electronic solutions. His patent and collaboration with skilled professionals like Kai Murakami highlight the importance of teamwork in driving innovation forward.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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