Chengdu, China

Ning Bu

This inventor holds 1 USPTO granted patent. Top assignee: Chengdu Monolithic Power Systems, Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ning Bu. Retrieved from https://idiyas.com/inventor/ning-bu-bv6pp3rj

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Ning Bu and a Pin-Efficient Power Management Chip

Introduction

Ning Bu is an inventor based in Chengdu, China, associated with Chengdu Monolithic Power Systems, Inc. His listed patent work focuses on improving how a power management chip uses its pins.

Latest Patents

The available information lists 1 patent for Ning Bu: “Power management chip with multiplexed pin and power management chip system including the same.” The invention describes a multiplexed pin that can receive a communication indication signal and transmit analog and digital signals. A communication circuit performs digital communication through the pin, while a logic control core configures the pin to transmit a digital signal based on the received indication. This approach is intended to reduce the number of pins required by the chip.

Career Highlights

Ning Bu’s listed invention addresses pin-resource efficiency in power management chip design. The patent identifies Chengdu Monolithic Power Systems, Inc. as his company.

Collaborations

Hao Wang, identified in the provided information as a woman, is listed as Ning Bu’s coworker. The available details do not specify her role in the patent or the nature of their collaboration.

Conclusion

Ning Bu’s listed patent presents a multiplexed-pin approach designed to support multiple signal functions while conserving pin resources in a power management chip.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…