Nikholas G Toledo

Title: Innovations of Nikholas G Toledo

Introduction

Nikholas G Toledo is an accomplished inventor based in Beaverton, Oregon. He is known for his significant contributions to the field of interconnect technology. His innovative work has led to the development of a patented technique that enhances the performance of metal interconnects.

Latest Patents

Nikholas holds a patent for "Cladded Metal Interconnects." This patent discloses techniques for providing cladded metal interconnects. The process involves conformally depositing a barrier layer onto the bottom and sidewalls of an interconnect trench. A bilayer adhesion liner is selectively deposited on the barrier layer, followed by the deposition of interconnect metal into the trench. The method ensures that the top surface of the interconnect metal is properly aligned and capped with bilayer adhesion liner materials, resulting in a robust cladded metal interconnect core.

Career Highlights

Nikholas is currently employed at Intel Corporation, where he applies his expertise in interconnect technology. His work at Intel has positioned him as a key player in advancing semiconductor manufacturing processes. He has made notable contributions that enhance the efficiency and reliability of electronic devices.

Collaborations

Nikholas has collaborated with esteemed colleagues, including Thomas N Marieb and Zhiyong Ma. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Nikholas G Toledo's innovative work in the field of cladded metal interconnects showcases his expertise and commitment to advancing technology. His contributions at Intel Corporation and his patented techniques are significant milestones in the realm of semiconductor technology.