Nikhil Raman

Title: Nikhil Raman: Innovator in Integrated Device Packaging

Introduction

Nikhil Raman is a notable inventor based in Cambridge, MA (US). He has made significant contributions to the field of integrated devices, particularly through his innovative patent. His work exemplifies the intersection of technology and engineering, showcasing his expertise in device packaging.

Latest Patents

Nikhil Raman holds a patent for a "Package comprising substrate with coupling element for integrated devices." This patent describes a package that includes a substrate with a first integrated device coupled to one surface and a second integrated device coupled to the opposite surface. The substrate features a dielectric layer and multiple interconnects. Notably, the interconnects are configured as inductors, allowing the first integrated device to connect to the first inductor and the second integrated device to connect to the second inductor. This design enables the second integrated device to tune the first inductor through the second inductor, enhancing the functionality of integrated devices.

Career Highlights

Nikhil Raman is currently employed at Qualcomm Incorporated, a leading company in the telecommunications and semiconductor industry. His role at Qualcomm allows him to work on cutting-edge technologies that drive innovation in mobile communications and integrated devices.

Collaborations

Throughout his career, Nikhil has collaborated with talented individuals such as Fnu Suraj Prakash and Paragkumar Ajaybhai Thadesar. These collaborations have contributed to the advancement of technology in their respective fields.

Conclusion

Nikhil Raman's contributions to integrated device packaging through his patent and work at Qualcomm highlight his role as an innovator in the technology sector. His expertise and collaborations continue to influence advancements in integrated devices.