Qualcomm Incorporated

Nikhil Raman

Paragkumar Ajaybhai Thadesar

Francesco Carrara

John Jong-Hoon Lee

Peng Song

Fnu Suraj Prakash

A package comprising a substrate, a first integrated device coupled to a first surface of the substrate, and a second integrated device coupled to a second surface of the substrate. The substrate includes a dielectric layer and a plurality of interconnects. The plurality of interconnects includes a first plurality of interconnects configured as a first inductor and a second plurality of interconnects configured as a second inductor. The first integrated device is configured to be coupled to the first inductor. The second integrated device is configured to be coupled to the second inductor. The second integrated device is configured to tune the first inductor through the second inductor.

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Cambridge, MA, United States of America

Nikhil Raman