Seattle, WA, United States of America

Nicole Yoshino


Average Co-Inventor Count = 9.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Innovations by Nicole Yoshino

Introduction

Nicole Yoshino is an accomplished inventor based in Seattle, Washington. She has made significant contributions to the field of technology, particularly through her innovative patent related to package similarity prediction systems. Her work at Amazon Technologies, Inc. showcases her expertise and dedication to advancing technological solutions.

Latest Patents

Nicole holds a patent for a package similarity prediction system. This invention involves techniques for predicting a manufacturer and/or contents of a received package. The system utilizes images captured from cameras to generate a visual vector for the package in a vector space of package attributes. Additionally, it receives physical attributes of the package and determines a subset of candidate packages by comparing these attributes to those of historically received packages. A ranking of the candidate packages is established by identifying distances in the vector space, ultimately allowing for the retrieval of data associated with a particular package from a database.

Career Highlights

Throughout her career, Nicole has demonstrated a strong commitment to innovation and problem-solving. Her role at Amazon Technologies, Inc. has allowed her to work on cutting-edge projects that enhance package processing and logistics. With one patent to her name, she has already made a notable impact in her field.

Collaborations

Nicole collaborates with talented individuals such as Huinan Ren and Kristin Quel Lien. These partnerships foster a creative environment that encourages the development of innovative solutions.

Conclusion

Nicole Yoshino's contributions to technology through her patent on package similarity prediction systems highlight her role as a forward-thinking inventor. Her work continues to influence advancements in package processing and logistics at Amazon Technologies, Inc.

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