Location History:
- Westwood, NJ (US) (2017)
- Denville, NJ (US) (2020 - 2024)
Company Filing History:
Years Active: 2017-2024
Title: Nicole Distefano: Innovator in Packaging Technology
Introduction
Nicole Distefano is a prominent inventor based in Denville, NJ (US). She has made significant contributions to the field of packaging technology, holding a total of 4 patents. Her innovative work focuses on the integration of 3D printing processes in packaging systems.
Latest Patents
One of her latest patents is titled "Packaging structures and additive manufacturing thereof." This patent describes a packaging system that includes a packaging unit and an article. The packaging unit consists of a solid layer, a porous layer, and a plastic layer with a cavity. The cavity is designed to receive and secure the article in an opening that is flexible between a first and a second dimension. The packaging unit is fabricated using a 3D printing process, where a tensioning device of a 3D printing machine tensions a feed filament during the printing process.
Career Highlights
Nicole Distefano is currently employed at Howmedica Osteonics Corporation, where she continues to develop innovative packaging solutions. Her work has been instrumental in advancing the capabilities of packaging technology through the use of additive manufacturing techniques.
Collaborations
Some of her notable coworkers include Marc Esformes and Robert W. Klein. Their collaborative efforts contribute to the innovative environment at Howmedica Osteonics Corporation.
Conclusion
Nicole Distefano is a trailblazer in the field of packaging technology, with a focus on 3D printing applications. Her contributions are shaping the future of packaging solutions, making her a key figure in the industry.