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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11931991 B1

PDFFull Text
Date of Patent:
Mar. 19, 2024

Filed:

Feb. 03, 2021

Packaging structures and additive manufacturing thereof

Applicant:

Howmedica Osteonics Corp., Mahwah, NJ (US);

Inventors:

Nicole Distefano, Denville, NJ (US);

Marc Esformes, Fishkill, NY (US);

Robert W. Klein, Orangeburg, NY (US);

Assignee:

Howmedica Osteonics Corp., Mahwah, NJ (US);

Attorney:

Lerner David LLP

Primary Examiner:

Joseph S Del Sole

Assistant Examiner:

Mohamed K Ahmed Ali

Int. Cl.
CPC ...
B32B 3/26 (2006.01); B29C 64/118 (2017.01); B32B 27/08 (2006.01); B32B 27/34 (2006.01); B33Y 30/00 (2015.01); B65D 81/02 (2006.01); B65D 81/05 (2006.01); A61F 2/00 (2006.01); B29L 31/00 (2006.01); B33Y 80/00 (2015.01);
U.S. Cl.
CPC ...
B32B 3/26 (2013.01); B29C 64/118 (2017.08); B32B 27/08 (2013.01); B32B 27/34 (2013.01); B65D 81/022 (2013.01); B65D 81/05 (2013.01); A61F 2/0095 (2013.01); B29L 2031/712 (2013.01); B32B 2250/03 (2013.01); B32B 2305/026 (2013.01); B32B 2439/80 (2013.01); B33Y 30/00 (2014.12); B33Y 80/00 (2014.12);
Abstract

A packaging system includes a packaging unit and an article. The packaging unit includes a solid layer, a porous layer and a plastic layer with a cavity. The cavity is configured to receive and secure the article in an opening defined by the cavity that is flexible between a first and a second dimension. The packaging unit is fabricated by a 3D printing process. A tensioning device of a 3D printing machine tensions a feed filament during the 3D printing process.

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Distefano, Nicole. (2024). Packaging structures and additive manufacturing thereof (U.S. Patent No. 11931991). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11931991

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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