Company Filing History:
Years Active: 2004-2005
Title: Nicole Butel: Innovator in Integrated Circuit Packaging
Introduction
Nicole Butel is a prominent inventor based in Fort Collins, Colorado. She has made significant contributions to the field of integrated circuit packaging, holding 2 patents that showcase her innovative approach to technology.
Latest Patents
Her latest patents include "Methods for providing an integrated circuit package with an alignment mechanism" and "Apparatus for aligning an integrated circuit package with an interface." The first patent describes a method that involves heating a wetting media applied to annular ring-shaped alignment pads on the integrated circuit package. This process allows for the attachment of alignment balls or bullets while the media is heated. The second patent focuses on alignment pads that can be solid or annular ring-shaped, where alignment members are attached via a wetting media that centers and bonds them when cooled.
Career Highlights
Nicole works at Agilent Technologies, Inc., where she continues to develop innovative solutions in her field. Her work has been instrumental in advancing the technology behind integrated circuits, making them more efficient and reliable.
Collaborations
Some of her notable coworkers include Gerald John D'Amato and Sari K Christensen, who contribute to the collaborative environment at Agilent Technologies.
Conclusion
Nicole Butel's contributions to integrated circuit packaging demonstrate her commitment to innovation and excellence in technology. Her patents reflect her expertise and the impact she has made in her field.