The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6872592 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 29, 2005

Filed:

Oct. 30, 2003
Applicants:

Gerald J. D'amato, Loveland, CO (US);

Sari K. Christensen, Fort Collins, CO (US);

Nicole Butel, Fort Collins, CO (US);

Inventors:

Gerald J. D'Amato, Loveland, CO (US);

Sari K. Christensen, Fort Collins, CO (US);

Nicole Butel, Fort Collins, CO (US);

Assignee:

Agilent Technologies, Inc., Palo Alto, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L021/44 ;
U.S. Cl.
CPC ...
Abstract

An integrated circuit package is provided with an alignment mechanism by 1) heating a wetting media that has been applied to a number of annular ring shaped alignment pads provided on the integrated circuit package, at known locations with respect to a pattern of contacts pads that is provided on the integrated circuit package, and then 2) while the wetting media is heated, attaching a number of alignment balls or alignment bullets to the annular ring shaped alignment pads.


Find Patent Forward Citations

D'Amato, Gerald. (2005). Methods for providing an integrated circuit package with an alignment mechanism (U.S. Patent No. 6872592). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6872592

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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