Clichy, France

Nicolas Le Lay

This inventor holds 1 USPTO granted patent and 2 EPO patents. Top assignee: Otor. Active years: 2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Nicolas Le Lay. Retrieved from https://idiyas.com/inventor/nicolas-le-lay

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

 

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: Innovations by Nicolas Le Lay: A Focus on Cardboard Packaging

Introduction

Nicolas Le Lay is an inventive mind based in Clichy, France. He has made significant contributions to the field of packaging, particularly through his innovative designs in cardboard boxes. His work emphasizes functionality and efficiency in packaging solutions.

Latest Patents

Nicolas Le Lay holds a patent for a "Cardboard box having a centring tab, blank, set of blanks and method for producing such a box." This invention relates to a box made from corrugated cardboard that features a polygonal section. The design includes at least one centring tab that straddles a folding line on the upper wall. The tab is connected to the upper wall and adjacent side wall through joining lines, allowing for a unique folding mechanism. The bottom of the box incorporates a perforated surface that complements the tab, ensuring a secure fit.

Career Highlights

Throughout his career, Nicolas has worked with notable companies such as Otor and DS Smith Packaging France. His experience in these organizations has allowed him to refine his skills in packaging design and innovation.

Collaborations

Nicolas has collaborated with talented individuals in the industry, including Olivier Bourdin and Arnaud Guerin. These partnerships have contributed to the development of innovative packaging solutions.

Conclusion

Nicolas Le Lay's contributions to cardboard packaging demonstrate his commitment to innovation and design. His patent reflects a thoughtful approach to solving practical problems in the packaging industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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