Paris, France

Nicolas Duny


 

Average Co-Inventor Count = 2.4

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2018-2025

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2 patents (USPTO):Explore Patents

Title: The Innovative Mind of Nicolas Duny

Introduction

Nicolas Duny is a prominent inventor based in Paris, France. He has made significant contributions to the field of computer science and 3D modeling. With a total of 2 patents, Duny's work focuses on enhancing the processing and compression of three-dimensional objects.

Latest Patents

Duny's latest patents include a method for processing a tessellation and a method for compressing and decompressing a 3D modeled object. The tessellation patent describes a computer-implemented method that forms a surface representation of a real-world 3D object. This method involves providing a constrained tetrahedral Delaunay mesh that is conformal and includes sets of tetrahedrons representing gaps in the tessellation. The method aims to minimize an objective function while adhering to specific constraints.

His second patent focuses on improving the compression of a 3D modeled object. This method involves providing a boundary representation of the modeled object and determining mappings between functions to enhance data compression. By replacing certain functions with optimized data, the method significantly improves the efficiency of 3D object representation.

Career Highlights

Nicolas Duny is currently employed at Dassault Systèmes, a leading company in 3D design software. His work at the company has allowed him to apply his innovative ideas in practical applications, contributing to advancements in the field.

Collaborations

Duny collaborates with talented coworkers, including Remy Rorato and Aurelien Jean Marie Alleaume. Their combined expertise fosters a creative environment that drives innovation in their projects.

Conclusion

Nicolas Duny's contributions to the field of 3D modeling and computer science are noteworthy. His innovative patents reflect his commitment to advancing technology and improving the efficiency of 3D object processing.

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