Vancouver, WA, United States of America

Nicholas Wang

This inventor holds 1 USPTO granted patent and 4 published patent applications and 1 EPO patent. Top assignee: Hewlett-Packard Development Company, L.p.. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Nicholas Wang. Retrieved from https://idiyas.com/inventor/nicholas-wang-b4i6d1zn

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

 

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Innovations of Nicholas Wang in 3D Printing Technology

Introduction

Nicholas Wang is an innovative inventor based in Vancouver, WA (US). He has made significant contributions to the field of 3D printing technology. His work focuses on enhancing the efficiency and sustainability of 3D printing processes.

Latest Patents

Nicholas Wang holds a patent for a build material recycling system of a three-dimensional (3D) printer. This innovative system includes a build material transport system, a build material recycling device featuring a fluidizing membrane, and a recycled build material hopper. These components work together to improve the recycling of build materials used in 3D printing.

Career Highlights

Nicholas Wang is currently employed at Hewlett-Packard Development Company, L.P. His role involves developing advanced technologies that push the boundaries of 3D printing. His patent reflects his commitment to creating more sustainable manufacturing processes.

Collaborations

Nicholas has collaborated with notable coworkers, including Robert Lawrence Winburne and Randall West. Their combined expertise contributes to the innovative projects at Hewlett-Packard.

Conclusion

Nicholas Wang's contributions to 3D printing technology demonstrate his dedication to innovation and sustainability. His work in developing a build material recycling system is a testament to his inventive spirit and commitment to advancing the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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